9/11/2023 0 Comments Transistor gate count![]() Gelsinger pointed out that “the system problems of today will become the chiplet problems of tomorrow.” New Philosophy The processor is composed of close to 50 active silicon tiles connected with a combination of Intel’s 2.5D and 3D packaging.Įach tile in the package, which packs 3,100 square millimeters of silicon into a 2,330-mm 2 footprint, was made using different technology nodes both from Intel and TSMC, translating to over 100 billion transistors. ![]() Intel is also tapping into its wide range of 2.5D packaging, including embedded multi-die interface bridge (EMIB), and its 3D logic-stacking technologies to help tie more silicon die-and thus, transistors-together in high-density chip packaging.Ī stark example of this trend is the high-performance GPU being built by Intel for the U.S. These are the keys to building smaller, faster, and more power-efficient transistors in the coming years, he said.īut innovations in transistor design will only take it so far. He cited innovations in transistor design, including its upcoming gate-all-around (GAA) transistors called RibbonFETs and new Power Via backside power-delivery system, coupled with the use of extreme-ultraviolet (EUV) technology and High-NA EUV later on. chip giant has process and packaging technologies in the pipeline that will allow it to hit 1 trillion by the end of the decade. While Intel can squeeze more than 100 billion transistors in a package today, he said the U.S. "Moore's Law-this continuing doubling of transistor capability as the dimensions shrink over time-is fundamentally the driver of everything that we’ve been able to accomplish," said Gelsinger.īut this gives it new ways to make chips more cheaply, more adaptable to its customers’ software, and able to meet the demands for more compute, connectivity, and AI in everything that runs on semiconductors. The remarks signal that Intel’s CEO does not believe in the impending demise of Moore’s Law, even as manufacturing chips becomes more costly and technically challenging. Intel’s role as a “systems foundry” is to help expand the ecosystem around chiplets and 2.5D and 3D advanced packaging technologies, creating new possibilities for innovative custom chips and system-level integration. “And the system is becoming an advanced package of multiple dies and chiplets. Literally, the system is becoming the advanced packaging technology of the future.” "If you think about it, the rack is becoming a system,” said Gelsinger. Foundries now have to be in the business of producing not only wafers, but whole systems tied together with software. He said the concept of a foundry is becoming more complicated than ever. It manufactures chips on contract according to others’ designs, while relying on rival foundries to make more of its own products. He is also building up a business called Intel Foundry Services to take on TSMC. Gelsinger is trying to execute on one of the company’s most ambitious roadmaps in quite some time to overtake TSMC and other rivals that have pulled ahead. Intel’s struggles are putting its dominance in data centers and other markets in peril for the first time in many years. The new philosophy is taking shape as Intel looks to return to the top of its game after falling behind in the high stakes battle to build the most advanced chips. Instead, Intel will focus on what it can squeeze in a system-in-package (SiP).Įverything from its future flagship Sapphire Rapids Xeon Scalable CPUs for the data center to its new family of personal-computer chips, called Meteor Lake, are enlisting 2.5D and 3D tile-based chip designs to wring out more performance, he said. Gelsinger said it is entering a new era that will require a shift from its relentless pursuit of trying to fit everything on a single system-on-chip (SoC) à la Moore’s Law. The Santa Clara, California-based company used the keynote of the annual Hot Chips conference to preview how it sees the world of semiconductors shaking out in the next several years. Intel CEO Pat Gelsinger said that it will take more than smaller, cheaper transistors to propel Moore’s Law in the coming years. Check out our coverage of the Hot Chips 2022 event.
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